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Kvalitetsstyringssystem og
Certifikater:
- Kvalitetssikring: ISO 9001:2000
- Miljø: ISO 14001
- CE og ROHS certificeret.
Kvalitetsstandard:
- Kvalitetsstandard iht: IPC-A-610 Standard klasse 1, 2 og 3
Hvor kvalitetsniveauet for ANSI / IPC er angivet ud fra:
-
Class 1 Consumer Products
-
Class 2 General Industrial
-
Class 3 High Reliability
Kvalitetsnormer for PCBA:
- Leverandørerne kan kvalitetsmæssigt leve op til ANSI(American national Standard Institute)
normer:
ANSI /I PC-A-610A class acceptability of elect. assemplies.
ANSI / IPC-R-700C class modification, rework and repair.
ANSI / IPC-CM-770 class printed board component mounting
-
Og Workmanschip standard EPF class:
-
CIV Civil Elektronik- svarende til ANSI class 1-2
-
MIL Militær - svarende til ANSI class3
- Funktionsfejl iht MIL-STD-105D:
- AQL
0,65 ved ordret in-circuittest og funktionstest.
- AQL
1,00 ved ordret funktionstest.
- Procesfejl
- Workmanship: AQL 2,5 i henhold til:
Kvalitetsniveau
og normer for PCB
PERFAG DIN/IEC326 eller IPC-A-600
Øvrig gældende normer:
IPC-D-275, Printed Wiring for Electronic Equipment
IPC-D-279, Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies
IPC-2221, Generic Standard for Printed Board Design
IPC-7095, Design and Assembly Process Implementation for BGA’s
IPC-782, Surface Mount Design and Land Pattern Standard
IPC-785, Guidelines for Accelerated Testing of Surface Mount
Solder Attachments
IPC-4101, Laminate/Prepreg Materials Standard for Printed Boards
IPC-7525, Stencil Design Guidelines
IPC-2315, Design Guide for High Density Interconnects (HDI) and
Microvias
IPC-CM-770, Guidelines for Printed Board Component Mounting 4
IPC-SM-840, Qualification and Performance of Permanent Polymer
Coating (Solder Mask) for Printed Boards
IPC-9701, Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments
IPC-780, Component Packaging With Emphasis on Surface Mounting
IPC-600, Acceptability of Printed Boards
IPC-610, Acceptability for Electronic Assemblies (ESD
requirements in Section 3.0)
IPC-6012, Qualification and Performance Specification for Rigid
Printed Boards Joint Industry Standards as:
ANSI/J-STD 001, Requirements for Soldered Electrical and
Electronic Assemblies
ANSI/J-STD 002, Solderability Tests for Component Leads,
Terminations, Lugs, Terminals, and Wires
ANSI/J-STD 003, Solderability Tests for Printed Boards
ANSI/J-STD 013, Implementation of Ball Grid Array and Other High
Density Technology
ANSI/J-STD 020, Handling Requirements for Moisture Sensitive
Components
ANSI/J-STD 033, Standard for Handling, Packing, Shipping, and
Use of Moisture/Reflow Sensitive Surface Mount Devices
IEEE 1149.1, Standard Test Access Port and Boundary Scan
Architecture
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