Kvalitetsstyringssystem og Certifikater:

  • Kvalitetssikring:  ISO 9001:2000
  • Miljø: ISO 14001
  • CE og ROHS certificeret.
  • Kvalitetsstandard iht: IPC-A-610 Standard klasse 1, 2 og 3
Hvor kvalitetsniveauet for ANSI / IPC er angivet ud fra:

           - Class 1 Consumer Products           
           - Class 2 General Industrial           
           - Class 3 High Reliability

Kvalitetsnormer for PCBA:

         - Leverandørerne kan kvalitetsmæssigt leve op til ANSI(American national Standard Institute) normer:           
               ANSI /I PC-A-610A class acceptability of elect. assemplies.           
               ANSI / IPC-R-700C class modification, rework and repair.           
               ANSI / IPC-CM-770 class printed board component mounting                  

       - Og Workmanschip standard EPF class:

           - CIV Civil Elektronik- svarende til ANSI class 1-2           
           - MIL Militær - svarende til ANSI class3           

       - Funktionsfejl iht MIL-STD-105D:
             - AQL 0,65 ved ordret in-circuittest og funktionstest.           
             - AQL 1,00 ved ordret funktionstest.           
       - Procesfejl

              - Workmanship: AQL 2,5 i henhold til:

Kvalitetsniveau og normer for PCB            

       PERFAG DIN/IEC326 eller IPC-A-600

  Øvrig gældende normer:

 IPC-D-275, Printed Wiring for Electronic Equipment
IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC-2221, Generic Standard for Printed Board Design
IPC-7095, Design and Assembly Process Implementation for BGA’s
IPC-782, Surface Mount Design and Land Pattern Standard
IPC-785, Guidelines for Accelerated Testing of Surface Mount Solder Attachments
IPC-4101, Laminate/Prepreg Materials Standard for Printed Boards IPC-7525, Stencil Design Guidelines
IPC-2315, Design Guide for High Density Interconnects (HDI) and Microvias
IPC-CM-770, Guidelines for Printed Board Component Mounting 4
IPC-SM-840, Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards
IPC-9701, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC-780, Component Packaging With Emphasis on Surface Mounting
IPC-600, Acceptability of Printed Boards
IPC-610, Acceptability for Electronic Assemblies (ESD requirements in Section 3.0)
IPC-6012, Qualification and Performance Specification for Rigid Printed Boards Joint Industry Standards as:
ANSI/J-STD 001, Requirements for Soldered Electrical and Electronic Assemblies
ANSI/J-STD 002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
ANSI/J-STD 003, Solderability Tests for Printed Boards
ANSI/J-STD 013, Implementation of Ball Grid Array and Other High Density Technology
ANSI/J-STD 020, Handling Requirements for Moisture Sensitive Components
ANSI/J-STD 033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices
IEEE 1149.1, Standard Test Access Port and Boundary Scan Architecture

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