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Rigrid PCB, FPCB, Flex-rigrit PCB,
MCPCB
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Service ydelser:
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Firma profil:
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- Rigid PCB
- FPCB
- Flex-rigid PCB
- MCPCB
- Alu. PCB
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- Ca 500 ansatte
- Areal 5000 m ²
- Honk Kong
- Shenzhen
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Kababilitet :
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Kvalitetsstandarder:
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- Antal lag 1-18
- Min. Line 0,075mm single
- Min. Line 0,1mm double S.
- Min. Line Afstand 0,1mm
- Min hul 0,15 mm
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- UL ISO 9000:2000
- QS 9000
- Norm: UL, CSA
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Min Ordre (MOQ): |
Prisniveau: |
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Min 1-3 Stk på quick service |
Under 30-40% af dansk pris. |
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APC´s partner produce High-density 2-18 layer circuit board
with blind and buried vias , High TG thick copper boards, Hi-frequency
boards, HDI board, FPC board , Rigid and Flexible boards, ALU-base
boards etc .COREPCB develops at high speed, , and its annual capacity has reached 200,000
㎡. It has become the important partner and friends of over 2000
companies both at home and abroad
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Leveringstid
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Item
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Quick
Turn
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General Lead Time
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Our Service
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Double Sided
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24h
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72h
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Quote in an
hour
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4-layer
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48h
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144h
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Technical
support at any time
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6-layer
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60h
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168h
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Marketing
service day and night
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8-layer
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72h
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192h
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Ship goods
all day long
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10-layer
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96h
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240h
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Production
boards around the clock
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>10-layer
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96h
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240h
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Parameters
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Item
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Technical Parameters
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Specification
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Min.Line Width(mil)
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3/4
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Partial 3mil lines is allowed
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Min.Space(mil)
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3/4
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Partial 4mil lines is allowed
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Min.Annular Ring Width(mil)
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VIAS:3mil
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Remained ring width means the distance between thehole edge
to the ring outskirt
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Component Holes:7mils
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Min.Hole Size
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Board Thickness<2.0mm
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0.15mm
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___
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Board Thickness>=2.0mm
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Aspect Ratio<=12
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___
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Max.Board Thickness
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Single and Double Sided
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8.0mm
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Multilayer
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8.0mm
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Min.Board Thickness
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Single and Double Sided
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0.2mm
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Multilayer
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4 layers:0.4mm; 6 layers:0.6mm
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8 layers:1.0mm;10 layers:1.2mm
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Max.Board Size
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Single and Double Sided
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650*1100mm
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Multilayer
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650*1100mm
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Distance between Line to Board edge
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Outline:0.20mm
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V-CUT:0.4mm
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Max.Layers
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18 layers
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Solder mask
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Mask Window(mil)
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2/4
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1.Single side；2.2mil is allowed for mask bridge or avoiding
exposed lines
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Mask Bridge(mil)
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5
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Between IC pins
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Color
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White,Black, Blue,Green,Yellow,Red,ect.
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___
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Legend
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Min.Line Width(mil)
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4
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Color
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White,Black,Yellow,ect.
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___
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Surface Plating
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HAL(with Pb free),Plated Ni/Au,Ag,Imm
Ni/Au,Imm Sn,Ag,OSP etc.
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Plating Thickness (microinch)
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Technique
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Plating Type
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Min.Thickness
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Max.Thickness
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Plated Ni/Au
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Ni
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100
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150
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Au
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1
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3
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Immersion Ni/Au
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Ni
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100
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150
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Au
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1
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4
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Gold Finger
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Ni
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120
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150
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Au
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10
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25
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Copper Plating Hole (micron)
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Copper Thickness
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20
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25
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Base Copper Thickness
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Inner Layers and Outer Layers(OZ)
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0.5
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13
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Finished Copper Thickness
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Outer Layers
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1
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13
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Inner Layers
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0.5
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13
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Insulation Layer(mm)
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0.06
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----
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Line Width/Space(mil)
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Max.Copper Thickness
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___
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4/4; 4/5
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0.5 OZ
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Line width shouldn't be less than the required value under
ensure of space.
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4/6; 5/5; 6/5
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1 OZ
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5/6; 6/6
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2 OZ
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6/8; 7/8; 8/8
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3 OZ
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8/10; 9/10; 10/10
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5 OZ
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___
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Board Materials
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FR-4; Aluminum Base; High Frequency; PFTE; FPC; Thick Copper;
BT Base;Pi Base; Tg130℃/ Tg170℃,Rogers4003, Berquist, Thermagon,
(Taconic)
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Board Outline Tolerance:
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L<=100mm： 0.1mm; 100mm<L<=200mm： 0.2mm; 200mm<L<=300mm：
0.3mm: 300mm<L<=.....： 0.3mm
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Finished Product Thickness Tolerance:
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0.2mm<T<0.5mm: +/-0.05mm; 0.5mm<T<0.8mm: +/-10%; >=0.8mm:
+/-8%
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Impedance Control:
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+/-10%
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Capacity
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Layers
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2-18 layers
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Max manufacturing size
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700 mm*1100 mm
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Board thickness
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Double sided
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0.2mm-6.0mm
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4 layers
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0.4mm-8.0mm
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6 layers
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0.8mm-8.0mm
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8 layers
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1.0mm-8.0mm
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10 layers
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1.2mm-8.0mm
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12 layers
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1.5mm-8.0mm
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Copper foil thickness
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0.5oz--13oz
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Min Line Width/Space
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3mil/3mil
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Min finished holes size
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0.15mm
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Aspect ratio
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12：1
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Impedance Control
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+/-10%
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Surface treatment
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HAL(with Pb free),Plated
Ni/Au,Ag,Imm Ni/Au,Imm Sn,Ag,OSP etc. |
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Materials
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FR4（S1130/S1141/S1170），Tg130℃/Tg170℃，Rogers，Berquist,thermagon,(taconic)
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Double sided Capacity
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60000M2/Year
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Multilayer Capacity
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100000M2/Year
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Kvalitets Certificering
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